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US 10,483,180 B2Granted
Process for the wafer-scale fabrication of hermetic electronic modules
AssigneePackaging Sip
InventorsChristian Val, Alexandre Val
Life of this patent
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Abstract
An electronic module including one or more electronic components that are electrically connected to a multilayer PCB circuit comprises, on one face, electrical connection balls for the external electrical connection of the electronic module. The PCB circuit comprises a hermetically protective electrically insulating inorganic inner layer, and the module comprises six faces with an electrically insulating or conductive inorganic hermetic protection layer on the five faces other than that formed by the PCB circuit.
Claims6
An electronic module comprising:
- a multilayer PCB circuit that comprises:
- on one face, electrical connection balls for external electrical connection of the electronic module;
- and
- a hermetically protective electrically insulating inorganic inner layer;
- an electrically insulating or conductive inorganic hermetic protection layer;
- one or more electronic components that are electrically connected to the PCB circuit;
- and
- six faces with the electrically insulating or conductive inorganic hermetic protection layer entirely covering the five faces other than that formed by the PCB circuit, wherein
- the hermetically protective electrically insulating inorganic inner layer is in direct contact with the electrically insulating or conductive inorganic hermetic protection layer so as to form a continuous hermetical joint around the one or more electronic components.
6 more elements
Dependencies are inferred from the claim text.