Semiconductor device including an encapsulation material defining notches

A semiconductor device comprising:

• a first contact element on a first side of the semiconductor device;
• a second contact element on a second side of the semiconductor device opposite to the first side;
• a semiconductor chip electrically coupled to the first contact element and the second contact element and
• an encapsulation material encapsulating the semiconductor chip and portions of the first contact element and the second contact element, the encapsulation material defining at least two notches on a third side of the semiconductor device and at least two notches on fourth side of the semiconductor device opposite to the third side, the third and fourth sides each free of contact elements and each having a length extending between the first side and the second side and a width perpendicular to the length, wherein the width is less than the length, and
• wherein each of the at least two notches extends across the lengths of the third and fourth sides.

A semiconductor device comprising:

• a first contact element on a first side of the semiconductor device;
• a second contact element on a second side of the semiconductor device opposite to the first side;
• a semiconductor chip electrically coupled to the first contact element and the second contact element and
• an encapsulation material encapsulating the semiconductor chip and portions of the first contact element and the second contact element, the encapsulation material defining at least two notches on a third side of the semiconductor device extending between the first side and the second side,
• wherein the first contact element comprises a first lead of a lead frame,
• wherein the second contact element comprises a second lead of the lead frame,
• wherein the lead frame comprises a die pad having a surface aligned with a surface of the encapsulation material,
• wherein the first lead has a surface aligned with the surface of the encapsulation material, and
• wherein the second lead has a surface aligned with the surface of the encapsulation material.

A semiconductor device comprising:

• a lead frame comprising a first lead on a first side of the semiconductor device and a second lead on a second side of the semiconductor device opposite to the first side;
• a semiconductor chip electrically coupled to the lead frame;
• and
• an encapsulation material encapsulating the semiconductor chip and portions of the lead frame, the encapsulation material defining at least two notches on a third side of the semiconductor device extending between the first side and the second side, the third side and the at least two notches extending perpendicularly to a surface of a die pad of the lead frame to which the semiconductor chip is attached.