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US 10,483,177 B2Granted
Package for a semiconductor die, method for making a die packaging bare die tape and method for semiconductor die packaging
AssigneeIntel Corporation
InventorsBassam Ziadeh, John Lofgren, Santosh Pabba, Kevin Pounds, Alin Ila
Life of this patent
Estimating the term…
Abstract
A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.
Claims25
A carrier medium for a semiconductor die, comprising:
- a carrier tape with at least one pocket for the die to sit in;
- and
- a selectively applied non-activated adhesive on the carrier tape wherein the adhesive is located outside of the at least one pocket.
A carrier medium, comprising:
- a carrier tape with at least one pocket and a selectively applied non-activated adhesive on the carrier tape;
- a semiconductor device sitting in the pocket;
- and
- a cover tape attached to the carrier tape by activation of the selectively applied adhesive.
1 more element
A method for manufacturing a carrier tape for a semiconductor die, comprising:
- providing a carrier tape material;
- forming a pocket in the carrier tape material for the die to sit in;
- and
- applying an adhesive on a surface of the carrier tape material outside of the pocket.
1 more element
A method for semiconductor die packaging, comprising:
- placing a die in a pocket within a carrier tape of a carrier medium, the carrier medium comprising:
- a carrier tape with at least one pocket for the die to sit in;
- and
- a selectively applied non-activated adhesive on the carrier tape outside of the at least one pocket;
- placing a cover tape on a surface of the carrier tape;
- and
- coupling the cover tape and the carrier tape.
4 more elements
Dependencies are inferred from the claim text.