Semiconductor module
AssigneeMitsubishi Electric Corporation
InventorDaisuke Oya
Life of this patent
Estimating the term…
Abstract
Provided is a semiconductor module in which a case and a base plate joined together with a simple structure, the semiconductor module having high insulation strength. The semiconductor module includes the following: a base plate; at least one semiconductor chip disposed inside the base plate other than the outer periphery of the base plate and above the base plate; and a case joined to the outer periphery of the base plate with an adhesive, and containing the at least one semiconductor chip. The upper surface of the base plate is provided with a recess or a protrusion between an inner wall of the case and the at least one semiconductor chip in a plan view.
Claims7
A semiconductor module comprising:
- a base plate;
- at least one semiconductor chip disposed above a region of the base plate inside of an outer peripheral region of the base plate;
- and
- a case joined to the outer peripheral region of the base plate with an adhesive, and containing the at least one semiconductor chip, wherein
- a protrusion is disposed on an upper surface of the base plate or the upper surface of the base plate comprises a recess, the recess or the protrusion being adjacent to an inner wall of the case and between the inner wall of the case and the at least one semiconductor chip in a plan view,
- the adhesive comprises a fillet-shaped portion between the inner wall of the case and the recess or the protrusion, and
- the fillet-shaped portion extends in a direction towards the at least one semiconductor device along the upper surface of the base plate from the inner wall of the case to an outermost side of the recess or protrusion adjacent to the inner wall of the case.
A semiconductor module comprising:
- a base plate;
- at least one semiconductor chip disposed above a region of the base plate inside of an outer peripheral region of the base plate;
- and
- a case joined to the outer peripheral region of the base plate with an adhesive, and containing the at least one semiconductor chip, wherein
- a protrusion is disposed on an upper surface of the base plate or the upper surface of the base plate comprises a recess, the recess or the protrusion being between an inner wall of the case and the at least one semiconductor chip in a plan view, and
- the adhesive comprises a fillet shape portion between the inner wall of the case and the recess or the protrusion, wherein
- the protrusion comprises a resist.
Dependencies are inferred from the claim text.