Integrated circuit component and package structure having the same

A package structure, comprising:

• a carrier substrate;
• an integrated circuit component, located on the carrier substrate, wherein the integrated circuit component comprises:
• a semiconductor substrate;
• conductive pads, located on and electrically connected to the semiconductor substrate and each having a testing region and a contact region comprising a core contact region and a buffer contact region, wherein along one direction, the conductive pads each have a maximum length less than a sum of a maximum length of the testing region and a maximum length of the buffer contact region;
• and
• conductive vias, respectively located on the core contact regions of the conductive pads, wherein the integrated circuit component is electrically connected to the carrier substrate through the conductive vias;
• and
• an underfill, encapsulating sidewalls of the conductive vias.