Semiconductor device inspection method and semiconductor device manufacturing method

A semiconductor device manufacturing method comprising:

• disposing a semiconductor chip on a lead frame;
• disposing a metal member on the semiconductor chip;
• irradiating the semiconductor chip or the metal member with first inspection light having a plurality of linear beams parallel to each other from a first direction inclining with respect to a top surface of the lead frame at least before disposing the metal member or after disposing the metal member, obtaining a first image of the semiconductor chip irradiated with the first inspection light or the metal member irradiated with the first inspection light, and calculating first three-dimensional information of the semiconductor chip or the metal member based on the first image by using an optical cutting method;
• and
• sealing the semiconductor chip and the metal member with a resin after calculating the first three-dimensional information.