Substrate liquid processing apparatus, substrate liquid processing method, and storage medium
AssigneeTokyo Electron Limited
InventorsHiroyuki Masutomi, Toshiyuki Shiokawa, Koji Tanaka, Takami Satoh
Life of this patent
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Abstract
The substrate liquid processing apparatus includes a processing bath that accommodates substrates, and a plurality of gas supply pipes provided in a processing bath. Ejection holes of one gas supply pipe and ejection holes of another adjacent gas supply pipe do not overlap each other in a direction parallel to the circuit-formed surfaces of the substrates.
Claims10
A substrate liquid processing apparatus comprising:
- a processing bath configured to accommodate therein a processing liquid including a phosphoric acid aqueous solution and a plurality of substrates arranged in a vertical direction, and process the substrates using the processing liquid;
- a processing liquid supply pipe configured to supply the processing liquid into the processing bath;
- and
- a plurality of gas supply pipes provided in the processing bath and configured to form bubbles by supplying a gas into the processing liquid,
- wherein the gas supply pipes are provided below the substrates, and extend in a horizontal direction perpendicular to circuit-formed surfaces of the substrates, a flow direction of a gas flowing through one gas supply pipe being directed opposite to a flow direction of a gas flowing through another adjacent gas supply pipe, and
- each of the gas supply pipes has a plurality of ejection holes formed directly on an outer surface of each of the gas supply pipes, ejection holes of one gas supply pipe and ejection holes of another gas supply pipe adjacent to the one gas supply pipe are arranged in a zigzag manner as viewed from a top of the processing bath, and the plurality of ejection holes are arranged to face upward in a direction parallel to the circuit-formed surfaces of the substrates.
A substrate liquid processing method performed using a substrate liquid processing apparatus that includes:
- a processing bath configured to accommodate therein a processing liquid including a phosphoric acid aqueous solution and a plurality of substrates arranged in a vertical direction, and process the substrates using the processing liquid;
- a processing liquid supply pipe configured to supply the processing liquid into the processing bath;
- and a plurality of gas supply pipes provided in the processing bath and configured to form bubbles by supplying a gas into the processing liquid, wherein the gas supply pipes are provided below the substrates, and extend in a horizontal direction perpendicular to circuit-formed surfaces of the substrates, a flow direction of a gas flowing through one gas supply pipe being directed opposite to a flow direction of a gas flowing through another adjacent gas supply pipe, and each of the gas supply pipes has a plurality of ejection holes formed directly on an outer surface of each of the gas supply pipes, ejection holes of one gas supply pipe and ejection holes of another gas supply pipe adjacent to the one gas supply pipe are arranged in a zigzag manner as viewed from a top of the processing bath, and the plurality of ejection holes are arranged to face upward in a direction parallel to the circuit-formed surfaces of the substrates,
- wherein the substrate liquid processing method comprises:
- supplying the gas into the processing liquid through the ejection holes from the one gas supply pipe and the other adjacent gas supply pipe;
- and
- forming bubbles rising between the substrates in the processing liquid.
A non-transitory computer-readable storage medium storing a computer-executable program that, when executed, causes a computer to execute a substrate liquid processing method using a substrate liquid processing apparatus:
- wherein the substrate liquid processing apparatus includes:
- a processing bath configured to accommodate therein a processing liquid including a phosphoric acid aqueous solution and a plurality of substrates arranged in a vertical direction, and process the substrates using the processing liquid;
- a processing liquid supply pipe configured to supply the processing liquid into the processing bath;
- and a plurality of gas supply pipes provided in the processing bath and configured to form bubbles by supplying a gas into the processing liquid, wherein the gas supply pipes are provided below the substrates, and extend in a horizontal direction perpendicular to circuit-formed surfaces of the substrates, a flow direction of a gas flowing through one gas supply pipe being directed opposite to a flow direction of a gas flowing through another adjacent gas supply pipe, and each of the gas supply pipes has a plurality of ejection holes formed directly on an outer surface of each of the gas supply pipes, ejection holes of one gas supply pipe and ejection holes of another gas supply pipe adjacent to the one gas supply pipe are arranged in a zigzag manner as viewed from a top of the processing bath, and the plurality of ejection holes are arranged to face upward in a direction parallel to the circuit-formed surfaces of the substrates,
- wherein the substrate liquid processing method comprises:
- supplying the gas into the processing liquid through the ejection holes from the one gas supply pipe and the other adjacent gas supply pipe;
- and
- forming bubbles rising between the substrates in the processing liquid.
Dependencies are inferred from the claim text.