Substrate treatment device and substrate treatment method

A substrate treatment method for cleaning and drying a substrate with fine patterns formed thereon, the substrate treatment method comprising:

• a first step of while rotating the substrate so that a surface with the fine patterns formed thereon faces downward, cleaning the substrate by jetting a cleaning solution from below the substrate toward the surface with the fine patterns formed thereon, and shaking off the cleaning solution;
• and
• a second step of, in a state that a treatment chamber is sealed and the substrate is held so that the surface with the fine patterns formed thereon faces downward, drying the substrate by heating the substrate by a heater disposed so that a distance between the heater and the substrate can be adjusted from an opposite side surface of the substrate opposite to the surface with the fine patterns formed thereon so that the cleaning solution remaining without being shaken off in the first step evaporates, wherein
• in the second step, inert gas is supplied from above the substrate toward the opposite side surface of the substrate opposite to the surface with the fine patterns formed thereon, the treatment chamber is exhausted from below the substrate through a gas exhaust port formed at a position facing the surface of the substrate with the fine patterns formed thereon so that the treatment chamber has a negative-pressure atmosphere, a droplet formed at an end of the fine patterns by aggregation of the cleaning solution which remains without being shaken off in the first step is guided to be discharged out of a space formed by the droplet and the fine patterns, and the inert gas flows in the order of the opposite side surface of the substrate opposite to the surface with the fine patterns formed thereon, a periphery of the substrate, and the surface of the substrate with the fine patterns formed thereon and is exhausted through the gas exhaust port.