Electronic-device-protecting film, electronic-device-protecting member, method for manufacturing electronic device, and method for manufacturing package

A method for manufacturing an electronic device comprising:

• an electronic-device-protecting member forming step of forming an electronic-device-protecting member by bonding an adhesive layer of an electronic-device-protecting film to one surface of a frame having an opening, the adhesive layer being bonded so as to cover the opening;
• a semiconductor-part bonding step of bonding a plurality of semiconductor parts to the surface of the adhesive layer that is exposed via the opening with the semiconductor parts set apart from each other;
• a sealant-covering step of covering the semiconductor parts and the surface of the adhesive layer with a sealant;
• and
• a heat-curing step of heat-curing the sealant to obtain an electronic device, wherein a side of a base layer of the electronic-device-protecting film is fixed by suction to a heated vacuum suction chuck table, in which the semiconductor parts are sealed in an array configuration, wherein
• the electronic-device-protecting film includes the base layer and the adhesive layer, and
• in the base layer, a thickness of the base layer is 15 μm or more and 50 μm or less, the ratio RE (=E′(160)/E′(50)) of the tensile elastic modulus E′(160) at 160° C. to the tensile elastic modulus E′(50) at 50° C. is such that 0.05<RE<1 and 1×108≤E′ (50)≤1×1010.