Semiconductor manufacturing apparatus and manufacturing method of semiconductor device

A semiconductor manufacturing apparatus comprising:

• a stage capable of mounting a substrate;
• a first nozzle supplying a chemical solution onto the substrate;
• a first protection plate provided along an outer circumference of the substrate, the first protection plate receiving the chemical solution splashing from the substrate;
• a second nozzle provided above the first protection plate, the second nozzle supplying pure water to an inner surface of the first protection plate;
• a second protection plate provided at an outside of the first protection plate, the second protection plate receiving the chemical solution splashing from the substrate;
• a third nozzle provided above the second protection plate, the third nozzle supplying pure water to an inner surface of the second protection plate;
• and
• a sucker sucking the chemical solution supplied onto the substrate, wherein
• an angle of inclination of the inner surface of the first protection plate is zero to 45 degrees with respect to an almost vertical direction,
• the inner surface of the first protection plate is hydrophilic so that a contact angle between the inner surface of the first protection plate and pure water is less than 90 degrees,
• the second nozzle is a pipe provided along an upper edge part of the first protection plate, the pipe comprising a plurality of first holes,
• the first holes are provided to the second nozzle at an inner surface side of the first protection plate,
• the third nozzle is a pipe provided along an upper edge part of the second protection plate, the pipe comprising a plurality of second holes,
• the second holes are provided to the third nozzle at an inner surface side of the second protection plate, and
• the stage rotates the substrate while the chemical solution or the pure water is supplied on the substrate.