Semiconductor device
AssigneeToshiba Memory Corporation
InventorsMasakazu Sawano, Takahiro Tomimatsu, Junichi Shibata, Hideki Inokuma, Hisashi Kato, Kenta Yoshinaga
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AssigneeToshiba Memory Corporation
InventorsMasakazu Sawano, Takahiro Tomimatsu, Junichi Shibata, Hideki Inokuma, Hisashi Kato, Kenta Yoshinaga
Estimating the term…
According to one embodiment, a semiconductor device includes: a first stack above a substrate and including insulation layers and conductive layers alternately stacked in a first direction, the first stack including a staircase-shaped portion in an end portion of the first stack in a second direction parallel to a main face of the substrate, the staircase-shaped portion including steps and terraces corresponding to the conductive layers, at least a part of the steps having arc shape curved along a third direction crossing the second direction; and a second stack above the substrate and including first and second layers stacked in the first direction. In the second and/or third direction, a dimension of the first stack is larger than a dimension of the second stack.
A semiconductor device comprising:
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.