Wiring board, TFT substrate, method for manufacturing wiring board, and method for manufacturing TFT substrate

A method for manufacturing a TFT substrate comprising:

• forming a gate comprising a gate electrode and a gate wiring on one surface of a substrate, the gate comprising copper;
• forming a protection film to cover the gate;
• forming an insulation film on the protection film;
• forming a semiconductor film on the insulation film;
• and
• forming a source and a drain on the semiconductor film in such a way that the source and the drain face each other with a space therebetween above the gate electrode,
• wherein the protection film is formed so as to cover an entire exposed surface of the gate,
• a plurality of the gates are formed in such a way that a plurality of the gate wirings are arranged in parallel,
• the protection film has a conductivity, and
• a short ring to connect the gate wirings adjacent to each other is formed of the protection film.