Object preparation device and particle beam device having an object preparation device and method for operating the particle beam device
AssigneeCarl Zeiss Microscopy GmbH
InventorJosef Biberger
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AssigneeCarl Zeiss Microscopy GmbH
InventorJosef Biberger
Estimating the term…
The system described herein relates to an object preparation device for preparing an object in a particle beam apparatus. By way of example, the particle beam apparatus is an electron beam apparatus and/or an ion beam apparatus. The system described herein moreover relates to a particle beam apparatus having such an object preparation device and to a method for operating the particle beam apparatus. The object preparation device may have an object receptacle device for receiving the object, a cutting device and a cutting bevel for cutting the object, wherein the cutting bevel may be arranged at the cutting device. The cutting bevel may lay in a cutting plane. Further, an axis of rotation may lay in the cutting plane. The cutting bevel may be embodied to be rotatable about the axis of rotation.
A particle beam apparatus for analyzing and/or for processing an object, comprising:
A method for operating a particle beam apparatus for analyzing and/or for processing an object, the particle beam apparatus having at least one beam generator for generating a particle beam comprising charged primary particles, an optical axis, at least one objective lens for focusing the particle beam onto the object, wherein interaction particles and/or interaction radiation arise/arises during an interaction of the particle beam with the object, at least one detector for detecting the interaction particles and/or the interaction radiation, and at least one object preparation device for preparing an object in the particle beam apparatus, the at least one object preparation device having at least one object receptacle device for receiving the object, at least one cutting device, and at least one cutting bevel for cutting the object, wherein the cutting bevel is arranged at the cutting device, wherein the cutting bevel lies in a cutting plane, an axis of rotation lies in the cutting plane, and the cutting bevel is embodied to be rotatable about the axis of rotation in such a way that the cutting plane is aligned perpendicular or substantially perpendicular to the optical axis of the particle beam apparatus, the method comprising the following steps:
Dependencies are inferred from the claim text.