Self directed metrology and pattern classification
AssigneeKLA-Tencor Corporation
InventorsAllen Park, Ajay Gupta, Jan Lauber
Life of this patent
Estimating the term…
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AssigneeKLA-Tencor Corporation
InventorsAllen Park, Ajay Gupta, Jan Lauber
Estimating the term…
Methods and systems for determining parameter(s) of a process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for determining an area of a defect detected on a specimen. The computer subsystem(s) are also configured for correlating the area of the defect with information for a design for the specimen and determining a spatial relationship between the area of the defect and the information for the design based on results of the correlating. In addition, the computer subsystem(s) are configured for automatically generating a region of interest to be measured during a process performed for the specimen with a measurement subsystem based on the spatial relationship.
A system configured to determine one or more parameters of a process to be performed on a specimen, comprising:
A non-transitory computer-readable medium, storing program instructions executable on a computer system for performing a computer-implemented method for determining one or more parameters of a process to be performed on a specimen, wherein the computer-implemented method comprises:
A computer-implemented method for determining one or more parameters of a process to be performed on a specimen, comprising:
Dependencies are inferred from the claim text.