Fabrication of vacuum electronic components with self-aligned double patterning lithography

A method of fabricating a component of a vacuum electronic device, the method comprising:

• fabricating a component of a vacuum electronic device on or in a substrate, comprising:
• disposing a first material on or in the substrate;
• removing a portion of the first material to form one or more structures of the first material, each of the one or more structures protruding from the substrate and having a first surface and a second surface;
• disposing a second material onto the first and second surfaces of the one or more structures of the first material;
• removing a portion of the second material from the first surface of the one or more structures to form one or more sidewall structures of the second material, the one or more sidewall structures being disposed on the second surface of the one or more structures of the first material;
• removing a second portion of the one or more structures of the first material to form a fabricated structure comprising the substrate and one or more sidewall structures protruding from the substrate;
• and
• disposing a third material onto the one or more sidewall structures, wherein the third material is suspended by the one or more support structures.