Substrates with integrated three dimensional solenoid inductors

A substrate comprising:

• a substrate body;
• and
• a three dimensional (3D) inductor integrated into the substrate body, wherein the 3D inductor comprises:
• a first vertical interconnect access structure (via) having a first via attachment surface that defines a first via surface contour;
• a first plating foil integrated into the first via to provide a second via attachment surface that is opposite the first via attachment surface and defines a second via surface contour;
• a first winding having a first winding end;
• a second plating foil integrated into the first winding to provide a first winding surface, wherein:
• the first winding surface includes a first winding end surface section that defines an exterior edge contour of the first winding end;
• and
• the first winding end surface section is directly attached to the first via attachment surface such that an exterior edge contour of the first winding end surface section is substantially aligned with and is substantially the same as an exterior edge contour of the first via surface contour;
• and
• a second winding having a second winding end and a second winding surface wherein the second winding end has a second winding end surface section provided by the second winding surface, wherein:
• the second winding end surface section is attached to the second via attachment surface such that an exterior edge contour of the second winding end surface section is substantially aligned with and is substantially the same as an exterior edge contour of the second via surface contour;
• and
• the first winding and the second winding are substantially aligned around a common axis, such that current is able to propagate through the first winding and the second winding in a same rotational direction.