Reduction of surface and embedded substrate charge by controlled exposure to vacuum ultraviolet (VUV) light in low-oxygen environment

A system for reducing surface and embedded charge in a substrate, comprising:

• a substrate support configured to support a substrate;
• a vacuum ultraviolet (VUV) assembly, of a processing chamber, that is arranged adjacent to the substrate support and that includes a housing and a VUV lamp that is connected to the housing and that generates and directs ultraviolet (UV) light at the substrate,
• wherein the housing includes:
• a first inlet to receive an oxygen-reducing purge gas;
• a first fluid channel in fluid communication with the first inlet,
• wherein the first fluid channel has an annular shape;
• and
• a first outlet in fluid communication with the first fluid channel;
• and
• a movement device configured to move the VUV assembly during exposure of the substrate to the UV light to reduce surface and embedded charge in the substrate,
• wherein the first outlet directs the oxygen-reducing purge gas into a gap between the VUV lamp and the substrate, and
• wherein the first outlet comprises one of:
• a plurality of spaced nozzles passing from the first fluid channel through a substrate-facing surface of the housing;
• and
• an annular slot passing from the first fluid channel through the substrate-facing surface of the housing.