Reclaimable semiconductor device package and associated systems and methods

A method of reclaiming a semiconductor device package having a plurality of semiconductor dies arranged in at least a first module of a first plurality of semiconductor dies and a second module of a second plurality of semiconductor dies, the method comprising:

• determining whether a first semiconductor die in the first module is inoperable and whether a second semiconductor die in the second module is inoperable, wherein the second semiconductor die is different from the first semiconductor die;
• storing a configuration state at a third semiconductor die in the semiconductor device package based on whether the first semiconductor die is inoperable and the second semiconductor die is inoperable, the configuration state indicative of which modules in the semiconductor device package are operable;
• coupling a package contact of the semiconductor device package with a first contact on a support substrate when none of the modules are inoperable;
• and
• coupling the package contact of the semiconductor device package with a second contact on the support substrate when at least one of the modules is inoperable, wherein the second contact is different from the first contact.