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US 10,481,658 B1Granted
Under-motherboard air cooling plenum
AssigneeDell Products L.P.
InventorsRobert Boyd Curtis, Corey Dean Hartman, Jonathan Foster Lewis
Life of this patent
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AssigneeDell Products L.P.
InventorsRobert Boyd Curtis, Corey Dean Hartman, Jonathan Foster Lewis
Estimating the term…
Components installed on a topside of printed circuit board (PCB), such as a motherboard, are provided airflow cooling by a plurality of cooling fans located on a proximal end of the PCB. A hardware component is installed on the topside of a distal end of the PCB, furthest from the cooling fans. The hardware component includes cooling elements that extend to the underside of the PCB. Cooling the hardware component is complicated by the distance from the cooling fans and the cooling elements that extend below the PCB. A plenum extending from the proximal end of the PCB towards the distal end of the PCB is installed on the underside of the PCB. The plenum draws airflow from the cooling fans and delivers the airflow to the hardware component along the underside of the PCB, thus avoiding heating by the components on the topside of the PCB.
An IHS (Information Handling Systems) comprising:
A plenum extending from a proximal end of a printed circuit board (PCB) towards a distal end of the PCB, wherein one or more hardware components are installed on a topside of the PCB, and wherein the PCB is provided airflow cooling by a plurality of cooling fans located on the proximal end of the PCB, and wherein the plenum is installed on an underside of the PCB and transfers air from the proximal end of the PCB to one or more cooling elements of a first hardware component installed on the topside of the distal end of the PCB, wherein the one or more cooling elements extend to the underside of the PCB, and wherein the plenum draws air from the plurality of cooling fans via an intake at the proximal end of the PCB.
A system for airflow cooling of a first hardware component, the system comprising
Dependencies are inferred from the claim text.