Cooling arrangement and air deflector
AssigneeFujitsu Client Computing Limited
InventorsRoland Treffler, August Scherer
Life of this patent
Estimating the term…
Abstract
A cooling arrangement for a computer system includes a chassis, a circuit board arranged in the chassis, a fan, and at least one element to be cooled and arranged on the circuit board in an area to be cooled between the fan and a panel of the chassis, wherein an air deflector is arranged between the at least one element to be cooled and the panel of the chassis such that air flowing out of the fan in a direction of the at least one element to be cooled encounters the air deflector and is swirled in the area to be cooled.
Claims14
A cooling arrangement for a computer system comprising a chassis, a circuit board arranged in the chassis, a fan, and at least one element to be cooled and arranged on the circuit board in an area to be cooled between the fan and a panel of the chassis,
- wherein an air deflector is arranged between the at least one element to be cooled and the panel of the chassis such that air flowing out of the fan in a direction of the at least one element to be cooled encounters the air deflector,
- the air deflector comprises a planar first plane oriented toward the fan, which planar first plane extends from the circuit board higher than the at least one element to be cooled,
- the air deflector is arranged to swirl the air flowing out of the fan in the direction of the at least one element to be cooled in the area to be cooled,
- a second plane angled relative to the planar first plane is attached on a first longitudinal side of the planar first plane, and
- the second plane has an angle of less than 90° in relation to the circuit board on the side facing the air flowing out of the fan.
A cooling arrangement for a computer system comprising a chassis, a circuit board arranged in the chassis, a fan, and at least one element to be cooled and arranged on the circuit board in an area to be cooled between the fan and a panel of the chassis,
- wherein an air deflector is arranged between the at least one element to be cooled and the panel of the chassis such that air flowing out of the fan in a direction of the at least one element to be cooled encounters the air deflector,
- the air deflector comprises a planar first plane oriented toward the fan, which planar first plane extends from the circuit board higher than the at least one element to be cooled, and
- the air deflector is arranged to swirl the air flowing out of the fan in the direction of the at least one element to be cooled in the area to be cooled,
- the air deflector comprises at least one pin, by which the air deflector is attached on at least one ventilation opening of the chassis, and
- the at least one pin has the shape of a hollow cylinder, which is open on both end faces.
Dependencies are inferred from the claim text.