Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith

A consumer electronic article of manufacture comprising:

• a housing comprising at least one housing substrate having an interior surface and an exterior surface;
• a combination comprising a composition and a substrate on which the composition is disposed, the composition comprising a matrix and encapsulated phase change material particles dispersed therein, wherein:
• the matrix comprises a pressure sensitive adhesive or an acrylic emulsion,
• the encapsulated phase change material has a melting point in the range of about 30° C. to about 100° C.,
• the composition comprises:
• about 10 to about 80% by volume of the matrix and
• about 20 to about 90% by volume of the encapsulated phase change material,
• the substrate is selected from the group consisting of a metallic, a metal-coated polymeric, a graphite or a metal-coated graphitic substrate, on which the composition is disposed, and wherein the combination is disposed on at least a portion of the interior surface of the at least one housing substrate;
• and
• at least one semiconductor package comprising an assembly comprising at least one of
• I.
• a semiconductor chip;
• a heat spreader;
• and
• a thermal interface material therebetween, or
• II.
• a heat spreader;
• a heat sink;
• and
• a thermal interface material therebetween.