Printed circuit board design and manufacturing

A method, comprising:

• generating a spatial model of a printed circuit board assembly based on at least one input file;
• using the spatial model to determine one or more spatial features not specified directly in the at least one input file;
• determining one or more manufacturing parameters based at least in part on the determined one or more spatial features not specified directly in the at least one input file;
• determining which of the one or more manufacturing parameters influence a proposal to manufacture the printed circuit board assembly, wherein the proposal includes a cost and/or time to manufacture the printed circuit board assembly;
• generating programmatically based at least in part on the determined one or more proposal influencing manufacturing parameters the proposal to manufacture the printed circuit board assembly;
• identifying one or more manufacturing parameters that can be modified, wherein the one or more identified manufacturing parameters include one or more corresponding adjustments to the one or more of the identified manufacturing parameters, wherein the one or more corresponding adjustments will result in an improvement to the proposal to manufacture the printed circuit board assembly;
• and
• specifying to a client device one or more of the identified manufacturing parameters.

A computer program product, the computer program product being embodied in a tangible non-transitory computer readable storage medium and comprising computer instructions for:

• generating a spatial model of a printed circuit board assembly based on at least one input file;
• using the spatial model to determine one or more spatial features not specified directly in the at least one input file;
• determining one or more manufacturing parameters based at least in part on the determined one or more spatial features not specified directly in the at least one input file;
• determining which of the one or more manufacturing parameters influence a proposal to manufacture the printed circuit board assembly, wherein the proposal includes a cost and/or time to manufacture the printed circuit board assembly;
• generating programmatically, based at least in part on the determined one or more proposal influencing manufacturing parameters, the proposal to manufacture the printed circuit board assembly;
• identifying one or more manufacturing parameters that can be modified, wherein the one or more identified manufacturing parameters include one or more corresponding adjustments to the one or more of the identified manufacturing parameters, wherein the one or more corresponding adjustments will result in an improvement to the proposal to manufacture the printed circuit board assembly;
• and
• specifying to a client device one or more of the identified manufacturing parameters.