Measurement method comprising in-situ printing of apparatus mark and corresponding apparatus
AssigneesASML Holding N.V., ASML Netherlands B.V.
InventorsKevin J. Violette, Igor Matheus Petronella Aarts, Haico Victor Kok, Eric Brian Catey
Life of this patent
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Abstract
A method, including printing an apparatus mark onto a structure while the structure is at least partly within a lithographic apparatus. The structure may be part of, or is located on, a substrate table, but is separate from a substrate to be held by the apparatus. The method further includes measuring the apparatus mark using a sensor system within the apparatus.
Claims20
A method, comprising:
- printing an apparatus mark onto a structure while at least partly within a substrate processing apparatus, the structure being separate from a substrate to be held by the apparatus, the printing involving using a patterned beam of radiation or using ablating radiation, such that the radiation directly contacts the structure when printing the apparatus mark;
- and
- measuring the apparatus mark using a sensor system within the apparatus.
A substrate processing apparatus, comprising:
- a structure;
- a sensor system configured to measure a mark;
- and
- a control system configured to at least:
- cause printing of an apparatus mark onto the structure while at least partly within the apparatus, the structure being separate from a substrate to be held by the apparatus, the printing involving using a patterned beam of radiation or using ablating radiation, such that the radiation directly contacts the structure when printing the apparatus mark, and
- cause measurement of the apparatus mark using the sensor system within the apparatus.
A non-transitory computer program product comprising machine-readable instructions therein, the machine-readable instructions, upon execution by a processor system, configured to cause the processor system to cause performance of at least:
- printing of an apparatus mark onto a structure while at least partly within a substrate processing apparatus, the structure being separate from a substrate to be held by the apparatus, the printing involving using a patterned beam of radiation or using ablating radiation, such that the radiation directly contacts the structure when printing the apparatus mark;
- and
- measuring of the apparatus mark using a sensor system within the apparatus.
Dependencies are inferred from the claim text.