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US 10,481,404 B1Granted
Rectangular cavity optical beam shaper and method of manufacturing the same
AssigneePalo Alto Research Center Incorporated
InventorsChristopher L. Chua, Yu Wang, David K. Biegelsen, Patrick Yasuo Maeda
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Abstract
A light beam shaper has a rectangular cavity bounded by wafer sidewalls and top and bottom caps. The top and bottom caps are wafer-bonded onto opposing surfaces of the wafer. A reflective coating covers inner surfaces of the cavity. A geometry of the cavity changes a light beam entering the cavity into a rectangular beam profile with uniform spatial intensity at the output.
Claims23
A light beam shaper, comprising,
- a wafer of crystalline semiconductor comprising a plurality of elongated channels separated by a plurality of elongated walls, the wafer being diced along a plurality of parallel lines that are at a non-zero angle to a longitudinal axis of the elongated channels such that the diced elongated walls form a plurality of wafer sidewalls;
- top and bottom caps wafer-bonded onto opposing surfaces of the wafer to form a rectangular cavity bounded by two of the wafer sidewalls;
- and
- a reflective coating on inner surfaces of the cavity, wherein a geometry of the cavity changes a light beam entering the cavity into a rectangular beam profile.
1 more element
An article of manufacture, comprising:
- a semiconductor wafer comprising a plurality of elongated channels separated by elongated walls;
- first and second wafers bonded to opposing sides of the semiconductor wafer, the first and second wafers enclosing the elongated channels to form rectangular cavities, the semiconductor wafer and first and second wafers being diced along a plurality of parallel lines that are at a non-zero angle to a longitudinal axis of the elongated channels to form a plurality of optical beam shapers;
- and
- a reflective coating on at least inner surfaces of the cavities of the optical beam shapers.
1 more element
A method, comprising:
- polishing opposing surfaces of a crystalline wafer, the opposing surfaces having a first crystal orientation;
- depositing a mask on one of the opposing surfaces;
- patterning the mask to define openings;
- etching elongated channels in the crystalline wafer through the openings, edges of the elongated channels forming sidewalls having a second crystal orientation resulting in the sidewalls being at right angles to the opposing surfaces;
- removing the mask;
- bonding first and second wafers to opposing surfaces of the crystalline wafer to form a wafer stack, the first and second wafers enclosing the elongated channels;
- dicing the wafer stack along parallel lines that are at a non-zero angle to a longitudinal axis of the elongated channels to form a plurality of light beam shapers, the enclosed elongated channels forming cavities of the light beam shapers;
- and
- applying a reflective coating to the inner surfaces of the cavities.
6 more elements
Dependencies are inferred from the claim text.