Semicondcutor packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChuei-Tang Wang, Jeng-Shien Hsieh, Hsing-Kuo Hsia, Chen-Hua Yu
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Abstract
Semiconductor packages are provided. The semiconductor package includes a photonic integrated circuit, an electronic integrated circuit and a high performance integrated circuit. The electronic integrated circuit is disposed aside the photonic integrated circuit and electrically connected to the photonic integrated circuit through a first redistribution structure. The high performance integrated circuit is disposed aside the electronic integrated circuit and electrically connected to the electronic integrated circuit through a second redistribution structure.
Claims20
A semiconductor package, comprising:
- a photonic integrated circuit;
- an electronic integrated circuit, disposed aside the photonic integrated circuit and electrically connected to the photonic integrated circuit through a first redistribution structure;
- and
- a high performance integrated circuit, disposed aside the electronic integrated circuit and electrically connected to the electronic integrated circuit through a second redistribution structure.
A semiconductor package, comprising:
- a photonic integrated circuit comprising an optical dielectric waveguide, wherein a portion of the optical dielectric waveguide is exposed;
- a laser die, optically coupled to the photonic integrated circuit;
- and
- an electronic integrated circuit electrically connected to the photonic integrated circuit.
A semiconductor package, comprising:
- a photonic integrated circuit;
- a laser die, disposed over the photonic integrated circuit;
- an electronic integrated circuit, electrically connected to the photonic integrated circuit;
- and
- a redistribution structure, disposed between the photonic integrated circuit and the laser die and comprising an optical dielectric layer optically coupling the laser die and the photonic integrated circuit.
Dependencies are inferred from the claim text.