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US 10,481,350 B1Granted
Through-board optical assembly
AssigneeSicoya GmbH
InventorsMoritz Grehn, Marco Vitali, Sebastian Höll, Andreas Hakansson, Chenhui Jiang
Life of this patent
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AssigneeSicoya GmbH
InventorsMoritz Grehn, Marco Vitali, Sebastian Höll, Andreas Hakansson, Chenhui Jiang
Estimating the term…
An embodiment of the invention relates to an optical assembly comprising a circuit board comprising a first side, a second side, and at least one hole that extends through the circuit board, a photonic chip having a front side and a back side, the front side of the photonic chip being mounted on the first side of the circuit board and electrically connected to at least one electrical conductor of the circuit board, at least one component being mounted on the front side of the photonic chip opposite the hole and protruding from the front side of the photonic chip into the hole or through the hole, and a wave-guiding element that is located on the second side of the circuit board and optically coupled to the photonic chip through said hole.
Optical assembly comprising
Method of fabricating an optical assembly comprising the steps of:
Dependencies are inferred from the claim text.