Calorimeter with diffusion-bonded block

A calorimeter system comprising:

• at least one sample cell and at least one reference cell in thermal communication with a common heat sink comprising a diffusion-bonded block, wherein the diffusion-bonded block comprises a first metallic layer having a first thermal conductivity, a second metallic layer having a second thermal conductivity and a third metallic layer having a third thermal conductivity, wherein the second metallic layer is between the first metallic layer and the third metallic layer, and wherein the second thermal conductivity is different than the first thermal conductivity and the third thermal conductivity;
• a temperature probe positioned to measure the temperature of the diffusion-bonded block;
• and
• a computer in electrical communication with the temperature probe and with either:
• a sample temperature sensor measuring a sample cell temperature and a reference temperature sensor measuring a reference cell temperature;
• or
• a differential temperature sensor measuring a differential temperature between the at least one sample cell and the reference cell;
• wherein the computer comprises a temperature control algorithm and a feedback control algorithm that control the temperature of the at least one sample cell and the temperature of the reference cell;
• and
• wherein the computer calculates the differential heat flow to the at least one sample cell with respect to the reference cell.

A calorimeter comprising:

• a sample cell and a reference cell;
• and
• a common heat sink comprising a first diffusion-bonded block thermally coupled to the sample cell and to the reference cell;
• wherein the first diffusion-bonded block comprises a first metallic layer diffusion-bonded to a second metallic layer, a third metallic layer diffusion-bonded to the second metallic layer and to a fourth metallic layer, and a fifth metallic layer diffusion-bonded to the fourth metallic layer;
• wherein the first metallic layer, the third metallic layer and the fifth metallic layer are characterized by having higher thermal conductivities and the second metallic layer and the fourth metallic layer are characterized by having lower thermal conductivities;
• and
• wherein the first metallic layer comprises a temperature probe.