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US 10,481,025 B2Granted
Piezoresistive sensor with spring flexures for stress isolation
AssigneeRosemount Aerospace Inc.
InventorsTimothy Thomas Golly, David P. Potasek, Cuong Tho Huynh
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Abstract
A MEMS device includes a backing wafer with a support portion and central back plate connected to the support portion with spring flexures, a diaphragm wafer with a support portions and a sensing portion connected to the support portion with spring flexures, a passivation layer on the diaphragm, and a topping wafer. The device allows for stress isolation of a diaphragm in a piezoresistive device without a large MEMS die.
Claims11
A sensor device comprising:
- a backing wafer comprising:
- a backing support portion, and
- a central backing plate connected to the backing support portion by one or more backing springs;
- a diaphragm wafer connected to the backing wafer, the diaphragm wafer comprising:
- a diaphragm support portion, and
- a sensing portion connected to the diaphragm support portion by one or more diaphragm springs;
- a passivation layer on the diaphragm wafer opposite the backing wafer;
- and
- a topping wafer connected to the passivation layer opposite the backing wafer;
- wherein the backing wafer and the diaphragm wafer are connected with frit, and wherein the diaphragm wafer and the topping wafer are connected with frit.
7 more elements
Dependencies are inferred from the claim text.