Electronic housing including a grooved cover

An apparatus, comprising:

• a support plate having a front mounting face;
• a microchip having a rear face attached to the front mounting face of the support plate and a front face including a first optical sensor and a second optical sensor;
• an encapsulation cover including a front wall, a peripheral wall projecting from the front wall and an inside partition projecting from the front wall and extending between opposite sides of said peripheral wall;
• wherein the peripheral wall is mounted by an adhesive to the front mounting face;
• wherein the inside partition is mounted by an adhesive to a front face of the microchip in a position that extends between the first and second optical sensors;
• and
• wherein a bottom edge of the inside partition adjacent to the front face of the microchip includes at least one accumulation and containment recess configured to at least partly receive the adhesive material and constrain the received adhesive material from creeping towards either of the first and second optical sensors;
• and
• wherein said first and second optical sensors of said microchip are located on opposite sides of said inside partition, wherein the front wall of the encapsulation cover includes a first opening facing the first optical sensor located in one of the two cavities, and wherein another of the two cavities includes another microchip attached to the support plate, this another microchip including a light radiation emitter, and wherein the front wall of the encapsulation cover further includes a second opening facing the light radiation emitter.

An apparatus, comprising:

• a support plate having a front mounting face;
• a microchip having a rear face attached to the front mounting face of the support plate and a front face;
• an encapsulation cover including a front wall, a peripheral wall projecting from the front wall and an inside partition projecting from the front wall and extending between opposite sides of said peripheral wall;
• wherein the peripheral wall is mounted by an adhesive to the front mounting face;
• wherein the inside partition is mounted by an adhesive to a front face of the microchip;
• and
• wherein a bottom edge of the inside partition adjacent to the front face of the microchip includes at least one accumulation and containment recess configured to at least partly receive the adhesive material, said at least one accumulation and containment recess comprising:
• at least one main groove extending longitudinally along the bottom edge of the inside partition;
• and
• secondary grooves extending longitudinally along the bottom edge of the inside partition parallel to and located on opposite sides of the at least one main groove;
• wherein a depth of the at least one main groove is greater than a depth of the secondary grooves.

An apparatus, comprising:

• a support plate having a front mounting face;
• a microchip having a rear face attached to the front mounting face of the support plate and a front face;
• an encapsulation cover including a front wall, a peripheral wall projecting from the front wall and an inside partition projecting from the front wall and extending between opposite sides of said peripheral wall;
• wherein the peripheral wall is mounted by an adhesive to the front mounting face;
• wherein the inside partition is mounted by an adhesive to a front face of the microchip;
• and
• wherein a bottom edge of the inside partition adjacent to the front face of the microchip includes at least one accumulation and containment recess configured to at least partly receive the adhesive material, said at least one accumulation and containment recess comprising:
• a first main groove extending longitudinally along the bottom edge of the inside partition;
• a second main groove extending longitudinally along the bottom edge of the inside partition parallel to the first main groove;
• and
• a first secondary groove extending longitudinally along the bottom edge of the inside partition parallel to and located between the first and second main grooves;
• wherein a depth of the first and second main grooves is greater than a depth of the secondary groove.