Cutting elements, methods for manufacturing such cutting elements, and tools incorporating such cutting elements

A cutting element comprising:

• a substrate comprising a substrate interface surface, the substrate interface surface comprising a protrusion, the protrusion comprising a base, a top end, a height extending axially from the base to the top end, and a width transverse to the height;
• and
• a polycrystalline diamond body formed by sintering at a cold cell pressure greater than 5.4 GPa, the polycrystalline diamond body comprising,
• a diamond interface surface interfacing with the substrate interface surface,
• a top surface opposite the diamond interface surface;
• a cutting edge meeting the top surface;
• and
• a material microstructure comprising a plurality of bonded-together diamond grains having an average grain size and interstitial regions between the diamond grains, the material microstructure comprising a first layer proximate the cutting edge and a second layer proximate the diamond interface surface,
• wherein at least a region of the first layer has a diamond volume fraction, as measured by electron backscatter diffraction, greater than (0.9077) (the diamond average grain size{circumflex over ( )}0.0221), with the diamond average grain size provided in microns,
• wherein the first layer has a diamond average grain size less than 12 microns,
• wherein the second layer has a diamond volume fraction that is lower than the diamond volume fraction of the first layer,
• wherein a width of the protrusion proximate the base is greater than a width of the protrusion proximate the top end,
• wherein the width of the protrusion decreases in a direction from the base to the top end, and wherein said protrusion has a height to width ratio of less than 0.5, and
• wherein said height to width ratio is determined by dividing the height of the protrusion by the width of the protrusion as measured at a middle of said height.