Composition and method for polishing memory hard disks exhibiting reduced edge roll off
AssigneeCabot Microelectronics Corporation
InventorSelvaraj Palanisamy Chinnathambi
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Abstract
The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising colloidal silica and fused silica, (b) a compound of formula (I) or a combination of a compound of formula (II) and a hydrophobic organic compound, (c) an amino acid, (d) hydrogen peroxide, and (e) water, wherein the polishing composition has a pH of about 1 to about 5. The invention also provides a method of chemically-mechanically polishing a substrate, especially a nickel-phosphorous substrate, by contacting the substrate with the inventive chemical-mechanical polishing composition.
Claims9
A chemical-mechanical polishing composition comprising:
- (a) an abrasive comprising colloidal silica and fused silica,
- (b) about 10 ppm to about 1000 ppm of a compound of formula (I):
- wherein R is selected from
- a straight chain or branched chain C1-C20 alkyl,
- R5C6H4, and
- R6—O—(R7O)n—,
- wherein R1-R5 are independently selected from straight chain or branched chain C1-C20 alkyls,
- wherein R6 is a straight chain or branched chain C1-C20 alkyl or R8—C6H4—,
- wherein R7 is a straight chain or branched chain C2-C10 alkylene,
- wherein R8 is a straight chain or branched chain C1-C20 alkyl,
- wherein n is an integer of from 1 to about 20,
- wherein X and Y are independently O or a covalent bond, and
- wherein A and B are independently an alkali metal cation or an organic amine compound,
- (c) an amino acid,
- (d) hydrogen peroxide, and
- (e) water,
- wherein the polishing composition has a pH of about 1 to about 5.
Dependencies are inferred from the claim text.