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US 10,479,897 B2Granted
Producing an apparatus by covering an electronic component with a conformal coating containing metal nanoparticles
AssigneeInternational Business Machines Corporation
InventorsDylan J. Boday, Joseph Kuczynski, Jason T. Wertz, Jing Zhang
Life of this patent
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Abstract
A method for producing an apparatus includes covering an electronic component with a conformal coating that includes a polymer and metal nanoparticles blended with the polymer. The electronic component is mounted on a substrate and electrically connected by metal conductors. The conformal coating overlies the metal conductors.
Claims8
A method for producing an apparatus, comprising the steps of:
- providing an electronic component mounted on a substrate and electrically connected by metal conductors;
- applying a conformal coating composition in an at least partially uncured state over the electronic component and the substrate, wherein the conformal coating composition comprises a polymer and metal nanoparticles blended with the polymer, wherein the metal nanoparticles have an average diameter within the range of 5 nm to 200 nm, and wherein the concentration of the metal nanoparticles in the conformal coating composition is approximately 5 wt % of the conformal coating and provides a level of electrical conduction sufficiently below the electric conducting percolation threshold to avoid shorting of the electronic component and the substrate;
- and
- curing the conformal coating composition applied over the electronic component and the substrate to produce a conformal coating that overlies the metal conductors.
1 more element
A method for producing an apparatus, comprising the steps of:
- providing an electronic component mounted on a substrate and electrically connected by metal conductors;
- applying a conformal coating composition in an at least partially uncured state over the electronic component and the substrate, wherein the conformal coating composition comprises a polymer and copper nanoparticles blended with the polymer, wherein the copper nanoparticles have an average diameter of approximately 100 nm, and wherein the copper nanoparticles comprise approximately 5 wt % of the conformal coating composition;
- and
- curing the conformal coating composition applied over the electronic component and the substrate to produce a conformal coating that overlies the metal conductors.
1 more element
Dependencies are inferred from the claim text.