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US 10,479,086 B2Granted
Process for making a molded device assembly and printhead assembly
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Thomas R Strand, Michael G Groh
Life of this patent
Estimating the term…
Abstract
In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board.
Claims16
A process for making a micro device assembly, comprising:
- placing a micro device on a front part of a printed circuit board;
- molding a molding on the printed circuit board surrounding the micro device;
- and then
- in a single operation, forming a channel to the micro device in a back part of the printed circuit board and opening a fluid passage in the micro device to the channel.
1 more element
A process for making a printhead assembly, comprising:
- arranging printhead dies on a front face of a printed circuit board;
- electrically connecting the dies to the printed circuit board;
- molding a single cover on the printed circuit board surrounding exposed fluid dispensing nozzles on each die;
- and then
- forming channels to the dies in a back part of the printed circuit board and opening a fluid passage in each die simultaneously with forming a corresponding channel in the printed circuit board.
2 more elements
A printhead assembly, comprising:
- a printed circuit board;
- a printhead die sliver mounted to a front part of the printed circuit board, the die sliver having fluid ejectors, fluid chambers each near an ejector, passages in a back part of the die through which fluid may flow to the chambers, and nozzles at a front part of the die sliver through which fluid may be ejected from the chambers;
- a molding covering the printed circuit board and surrounding the nozzles at the front part of the die sliver;
- and
- a single channel that extends through the back part of the printed circuit board and into the back part of the die sliver to the passages in the die sliver.
2 more elements
Dependencies are inferred from the claim text.