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US 10,479,085 B2Granted
Printhead electrical interconnects
AssigneeHewlett-Packard Development Company, L.P.
InventorsDevin Alexander Mourey, Chien-Hua Chen, Michael W. Cumbie
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Abstract
In one example, a method for fabricating a printhead is described. The method may include applying an electrical interconnect between a printhead die and an electrical fan out structure embedded in a molding of a printhead via a direct patterning additive process. The method may further include applying a passivation layer over the electrical interconnect as a dry film laminate.
Claims20
A method comprising:
- applying an electrical interconnect between a printhead die and an electrical fan out structure embedded in a molding of a printhead via a direct patterning additive process;
- and
- applying a passivation layer over the electrical interconnect as a dry film laminate.
A device comprising:
- a printhead die;
- a printed circuit assembly;
- a molding, wherein the printhead die and the printed circuit assembly are embedded in a surface of the molding;
- and
- an interconnect structure comprising:
- an electrical interconnect over an electrical contact of the printhead die, an electrical contact of the printed circuit assembly, and a portion of the surface of the molding between the printhead die and the printed circuit assembly;
- and
- a passivation layer over the electrical interconnect, wherein a thickness of the interconnect structure is less than 100 microns.
5 more elements
A method, comprising:
- applying a conductive layer between a printhead die and a printed circuit assembly embedded in a molding of a printhead via a shadow mask process to form an electrical interconnect;
- and
- applying a dielectric layer over the electrical interconnect as a dry film laminate.
Dependencies are inferred from the claim text.