Peeling method of cover member and manufacturing method of liquid ejecting head
AssigneeSeiko Epson Corporation
InventorTatsuro Hotta
Life of this patent
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AssigneeSeiko Epson Corporation
InventorTatsuro Hotta
Estimating the term…
Disclosed is a peeling method of a cover member including forming a recessed portion that opens one side surface of a substrate, on a region different from a region in which a pattern is formed and forming an opening region including the opening of the recessed portion; attaching the cover member so as to cover the one side surface; adjusting a pressure for increasing a pressure within a space formed by the recessed portion and the cover member by attaching the cover member to the substrate to be higher than a pressure on a side opposite to the space with the cover member interposed therebetween; and peeling off the cover member from the substrate, in a state where the pressure within the space is increased by the adjusting of the pressure.
A method for peeling a cover member off of a substrate, the method comprising:
Dependencies are inferred from the claim text.