Head module and liquid jetting apparatus including the same

A head module configured to be removably attached to a liquid jetting apparatus along an attaching direction, comprising:

• a head having;
• an inlet;
• a plurality of nozzles configured to jet a liquid inflowed thereto via the inlet;
• and
• a plurality of driving elements configured to impart a jetting energy to the liquid in the plurality of nozzles, respectively, the plurality of nozzles being aligned in a row in a first direction parallel to a nozzle surface which is orthogonal to the attaching direction;
• a driver IC configured to drive the plurality of driving elements;
• a heat spreader thermally making contact with the driver IC;
• a flexible substrate connected to the driver IC;
• and
• a rigid substrate connected to the flexible substrate and having rigidity higher than that of the flexible substrate,
• wherein in the attaching direction, the driver IC is arranged between the head and the heat spreader;
• the rigid substrate and the head are arranged side by side in the attaching direction;
• the rigid substrate and the heat spreader are arranged side by side in the first direction;
• and
• the rigid substrate has a thickness along the first direction.

A head module comprising:

• a head chip having:
• nozzles aligned in a row in a first direction crossing a second direction, the nozzles being extending along a third direction which is perpendicular to the first and second directions;
• and
• driving elements positioned to respectively impart a jetting energy to the liquid in the nozzles;
• a head holder supporting the head chip and having an inlet communicated with the nozzles;
• a driver IC connected to the driving elements and configured to drive the driving elements;
• a heat spreader thermally making contact with the driver IC;
• a flexible substrate connected to the driver IC;
• a rigid substrate connected to the flexible substrate and having rigidity higher than that of the flexible substrate;
• and
• a connector positioned on one end of the rigid substrate in the third direction;
• wherein:
• the driver IC is positioned between the head chip and the heat spreader in the third direction;
• the other end of the rigid substrate in the third direction is supported by the head holder within a projection plane of the head holder in the third direction;
• the rigid substrate and the heat spreader are arranged side by side in the first direction;
• the rigid substrate has a thickness along the first direction;
• and
• one end of the connector in the third direction is further from the head holder than the one end of the rigid substrate in the third direction.