Print head substrate and method of manufacturing the same, and semiconductor substrate
AssigneeCanon Kabushiki Kaisha
InventorsRyo Kasai, Masataka Sakurai, Koichi Ishida
Life of this patent
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Abstract
A print head substrate includes: a substrate surface including a plurality of printing elements and a plurality of pads disposed along a first side and electrically connected to the printing elements, the substrate surface having an acute angle portion formed by the first side and a second side; and a test element group (TEG) area including a TEG not electrically connected to the printing elements, at least a part of the TEG area being located between the second side and a pad closest to a vertex of the acute angle portion among the pads.
Claims20
A print head substrate comprising:
- a substrate surface including a plurality of printing elements and a plurality of pads disposed along a first side and electrically connected to the printing elements, the substrate surface having an acute angle portion formed by the first side and a second side;
- and
- a test element group (TEG) area including a TEG not electrically connected to the printing elements, at least a part of the TEG area being located between the second side and a pad closest to a vertex of the acute angle portion among the pads.
A method of manufacturing a print head substrate,
- the print head substrate including:
- a substrate surface including a plurality of printing elements and a plurality of pads disposed along a first side and electrically connected to the printing elements, the substrate surface having an acute angle portion formed by the first side and a second side;
- and
- a test element group (TEG) area including a TEG not electrically connected to the printing elements, at least a part of the TEG area being located between the second side and a pad closest to a vertex of the acute angle portion among the pads,
- the method comprising:
- forming a pattern of an affected layer inside a wafer substrate;
- and
- cutting out the print head substrate having the acute angle portion by cleaving the wafer substrate along the formed pattern.
A semiconductor substrate comprising:
- a substrate surface including a plurality of elements and a plurality of pads disposed along a first side and electrically connected to the elements, the substrate surface having an acute angle portion formed by the first side and a second side;
- and
- a test element group (TEG) area including a TEG not electrically connected to the elements, at least a part of the TEG area being located between the second side and a pad closest to a vertex of the acute angle portion among the pads.
Dependencies are inferred from the claim text.