Component bonding device
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsAkira Kameda, Shinjiro Tsuji
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AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsAkira Kameda, Shinjiro Tsuji
Estimating the term…
A component bonding device includes a bonding tool which sucks a film-like component and which bonds the film-like component to a substrate. The bonding tool includes: a plurality of suction blocks, each of which has a suction hole for sucking the film-like component; and a suction block holding portion which has a block holding-available region capable of holding the plurality of suction blocks, and which holds the plurality of suction blocks so as to be arranged in a row in the block holding-available region. The suction block holding portion allows change of a holding position of at least one of the plurality of suction blocks to any desired position in the block holding-available region.
A component bonding device comprising:
A component bonding device comprising:
A component bonding device comprising:
Dependencies are inferred from the claim text.