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US 10,479,055 B2Granted
Multilayer structure, packaging material and product including same, and protective sheet for electronic device
AssigneeKuraray Co., Ltd.
InventorsRyoichi Sasaki, Yasutaka Inubushi
Life of this patent
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Abstract
The present invention relates to a multilayer structure including a base (X) and a layer (Y) stacked on the base (X). The layer (Y) contains an aluminum-containing compound (A), an organic phosphorus compound (BO), and a polymer (F) having an ether bond and having no glycosidic bond.
Claims16
A multilayer structure comprising a base (X) and a layer (Y) stacked on the base (X), wherein
- the layer (Y) comprises an aluminum-containing compound (A), an organic phosphorus compound (BO), and a polymer (F) having an ether bond and having no glycosidic bond, and
- the organic phosphorus compound (BO) is a polymer (BOa) having the phosphorus atom-containing functional group.
Dependencies are inferred from the claim text.