Loading patent…
AssigneesNidec-Shimpo Corporation, Nidec Corporation
InventorsTetsuya Iwakuro, Takayuki Sawada, Masayuki Otani, Kazuyoshi Koga, Takafumi Maeda, Takeshi Honda, Nobuyuki Kita
Estimating the term…
Provided is an abnormality prediction system and an abnormality prediction method that are capable of predicting an abnormality occurring in a die that is used in a press machine. A die abnormality prediction system (50) includes: an acoustic emission (AE) sensor (62) configured to detect an elastic wave that occurs in a processing portion of a die during processing performed by a press machine using the die; a stamping load detection sensor (61) configured to detect a parameter (a stamping load) other than a parameter regarding the elastic wave, out of parameters regarding a state of the die during the processing performed by the press machine using the die; a score calculation unit (56) configured to calculate an abnormality prediction score of the die based on an output signal from the AE sensor (62) and an output signal from the stamping load detection sensor (61); and an abnormality prediction unit (57) configured to predict an abnormality occurring in the die, based on a result of the calculation performed by the score calculation unit (56).
A die abnormality prediction system for predicting an abnormality in a die that is used in a press machine, comprising:
A die abnormality prediction method for predicting an abnormality in a die that is used in a press machine, comprising:
Dependencies are inferred from the claim text.