US 10,478,617 B2Granted

Thin-film electrode assembly with soft overmold

AssigneeVerily Life Sciences LLC

InventorsBrian Pepin, Shiv Sabesan, Bo Lu

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Abstract

The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to a thin-film electrode assemblies and methods of fabricating the thin-film electrode assembly to include a soft overmold. Particularly, aspects of the present invention are directed to a thin-film electrode assembly that includes an overmold and a supporting structure formed within a portion of the overmold. The overmold includes a first polymer and the supporting structure includes a second polymer, different from the first polymer. The thin-film electrode assembly also includes a wire formed within a portion of the supporting structure, and an electrode formed on a top surface of the supporting structure and in electrical contact with the wire. The electrode has a top surface that is raised above a top surface of the overmold by a predetermined distance.

Claims17

Dependent claims

A thin-film electrode assembly comprising:

an overmold comprising a first polymer;
a supporting structure formed within a portion of the overmold, wherein the supporting structure comprises a second polymer, different from the first polymer;
a wire formed within a portion of the supporting structure;
an electrode formed on a top surface of the supporting structure and in electrical contact with the wire,
wherein the electrode comprises a top surface that is raised above a top surface of the overmold by a predetermined distance;
another supporting structure formed within another portion of the overmold;
another wire formed within a portion of the another supporting structure;
and
another electrode formed on a top surface of the another supporting structure and in electrical contact with the another wire,
wherein the another electrode comprises a top surface that is raised above the top surface of the overmold by the predetermined distance, and
wherein the supporting structure and the electrode are isolated from the another supporting structure and the another electrode by a region of the overmold.

8 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/597,187Filed 17 May 2017
Published: US 2018/0333571 A122 Nov 2018
Granted: 19 Nov 2019
Term ends: Not estimatedThe source records don’t support an estimate.

Classification13 codes

A61N 1/0551
For implantation or insertion into the body, e.g. heart electrode: spinal or peripheral nerve electrodes
A61N 1/0553
Spinal or peripheral nerve electrodes: paddle shaped electrodes, e.g. for laminotomy
A61N 1/0556
Spinal or peripheral nerve electrodes: cuff electrodes
A61N 1/056
For implantation or insertion into the body, e.g. heart electrode: transvascular endocardial electrode systems

Family

US 2018/0333571 A1Pre-grant publication · published 22 Nov 2018
US 10,478,617 B2This patent

From the US filing history. Foreign family members aren’t listed.

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