Template, method for fabricating template, and method for manufacturing semiconductor device

A template comprising:

• a plurality of first protrusion portions provided alternately with a plurality of first recess portions having a first depth;
• a second recess portion surrounding the first recess portions and having a second depth deeper than the first depth;
• a second protrusion portion provided between the first recess portions and the second recess portion;
• and
• a third protrusion portion surrounding the second recess portion, the second recess portion being provided between the second protrusion portion and the third protrusion portion.

A method for manufacturing a semiconductor device comprising:

• applying or dropping a resin onto a wafer;
• preparing a template fabricated by:
• providing a substrate having a first protrusion portion;
• forming, on the first protrusion portion of the substrate, a first film that includes a plurality of first pattern portions having a first film thickness and a second pattern portion surrounding the first pattern portions and having a second film thickness thicker than the first film thickness;
• covering at least a portion of the first film with a second film;
• removing the second pattern portion;
• exposing the first pattern portions by removing a portion of the second film from an upper surface of one or more of the first pattern portions by a first etching process, and forming a second protrusion portion in the substrate by etching the first protrusion portion of the substrate using the second film as a mask;
• removing the first pattern portions;
• and
• processing the first protrusion portion and the second protrusion portion by a second etching process using the second film as a mask;
• imprinting a pattern forming surface of the second protrusion portion of the template with the resin and curing the resin;
• and
• releasing the template from the cured resin.