High-frequency module

A high-frequency module comprising:

• a wiring board;
• a first component mounted on a first principal surface of the wiring board;
• a first sealing resin layer laminated on the first principal surface of the wiring board and sealing the first component;
• and
• a third shield layer laminated on the first sealing resin layer so as to cover an opposite surface of the first sealing resin layer and a peripheral side surface of the first sealing resin layer, the opposite surface being opposite to the first principal surface of the wiring board,
• wherein the third shield layer includes an adhesion film laminated on the first sealing resin layer and a conductive film laminated on the adhesion film, and
• wherein a ratio of a thickness of the adhesion film on a side of the peripheral side surface to a thickness of the adhesion film on a side of the opposite surface is smaller than a ratio of a thickness of the conductive film on the side of the peripheral side surface to a thickness of the conductive film on the side of the opposite surface.