High-frequency connecting device with enhanced cooling efficiency of optical module

A high-frequency connecting device with enhanced cooling efficiency of optical module, comprising:

• a housing having an upper cover, two side walls and a lower cover, and an accommodating space being formed between the upper cover, the two side walls and the lower cover;
• a sandwiched member disposed in the accommodating space and partitioning the accommodating space into an upper space and a lower space;
• an inner heat sink disposed inside the sandwiched member, a top and a bottom of the inner heat sink respectively having a first contact portion and a second contact portion, and the first contact portion and the second contact portion respectively exposed to the upper space and the lower space;
• a rear heat sink disposed behind the housing;
• a heat pipe connected between the inner heat sink and the rear heat sink;
• a upper heat sink disposed on the upper cover of the housing, a bottom of the upper heat sink having a third contact portion protruding therefrom, the third contact portion exposed at the upper space, and a fourth contact portion elastically disposed on the lower cover of the housing and exposed at a bottom of the lower space;
• and
• a connector disposed inside the housing and configured to plug in a first optical module and a second optical module;
• wherein the first optical module and the second optical module are respectively inserted into the upper space and the lower space for plugging in the connector, and a top and a bottom of the first optical module are in direct contact respectively with the third contact portion and the first contact portion, while a top and a bottom of the second optical module are in direct contact respectively with the second contact portion and the fourth contact portion.