Stacked circuit board architecture in an electronic device

An electronic device, comprising:

• an enclosure that defines an internal volume;
• and
• a stacked circuit board assembly disposed in the internal volume, the stacked circuit board assembly comprising:
• a first circuit board that carries a first operational component on a first mounting surface, the first circuit board further carrying a second operational component on a second mounting surface that is opposite the first mounting surface, wherein the second operational component comprises a recess, and
• a second circuit board that is overlaid by the first circuit board, the second circuit board carrying a third operational component on a third mounting surface that faces the second mounting surface, wherein the third operational component comprises a protrusion that at least partially extends into the recess,
• wherein the second operational component and the third operational component each comprise an integrated circuit;
• and
• a battery assembly disposed in the internal volume, the battery assembly including an L-shaped configuration such that the battery assembly accommodates the stacked circuit board assembly in the internal volume.

A method for forming a circuit board assembly, the method comprising:

• providing a first circuit board that includes a first operational component, the first operational component comprising an integrated circuit and having a recess formed therein;
• and
• securing a second circuit board to the first circuit board in a stacked configuration such that the first circuit overlays the second circuit board, the second circuit board including a second operational component comprising an integrated circuit and having a protrusion formed thereon, wherein the protrusion is at least partially positioned in the recess in the stacked configuration;
• positioning an interposer between the first circuit board and the second circuit board;
• electrically coupling the interposer with the first circuit board and the second circuit board;
• positioning a second interposer between the first circuit board and the second circuit board, the second interposer electrically coupled to the first circuit board and the second circuit board;
• and
• positioning a solder mask between the interposer and the second interposer, the solder mask preventing an electrical coupling between the interposer and the second interposer.