Hydraulic bladder for CPU interconnection and cooling

A computer system comprising:

• a first system board and a second system board;
• a first socket coupled with the first system board and a second socket coupled with the second system board;
• a first integrated circuit (IC) package having a plurality of interconnects coupled with the first socket and a second IC package having a plurality of interconnects coupled with the second socket;
• a first hydraulic bladder to provide a force against a first side of the first IC package such that a compressive force is maintained between a second side of the IC package and the first socket;
• and
• a second hydraulic bladder to provide a force against a first side of the second IC package such that a compressive force is maintained between a second side of the second IC package and the second socket, wherein the second hydraulic bladder is between the second IC package and a second side of the first system board opposite the first side of the first system board.