Modular cooling

A system to provide modular cooling of an electronic system comprising:

• a liquid cooling system to directly cool the electronic system;
• an air cooling system to directly cool the electronic system separately from the liquid cooling system cooling the electronic system;
• and
• a connection assembly including:
• a liquid connection positioned in a first location of the connection assembly to connect to the liquid cooling system and to a corresponding liquid connection of an electronic system, the liquid connection to provide a first interface between the liquid cooling system and the electronic system to directly cool the electronic system by liquid passing from the liquid cooling system through the liquid connection of the connection assembly and through the corresponding liquid connection of the electronic system to the electronic system;
• and
• an air connection positioned in a second location of the connection assembly to connect to the air cooling system and to a corresponding air connection of the electronic system, the air connection to provide a second interface between the air cooling system and the electronic system to directly cool the electronic system by air passing from the air cooling system through the air connection of the connection assembly and through the corresponding air connection of the electronic system to the electronic system,
• wherein the liquid connection and the air connection provide an interface of the connection assembly by which the liquid cooling system and the air cooling system are connected to the electronic system to permit the liquid cooling system and the air cooling system to directly and separately cool the electronic system.

A modular cooling system comprising:

• a liquid cooling system to directly cool an electronic system;
• an air cooling system to directly cool the electronic system separately from the liquid cooling system;
• a swappable liquid connection to connect to the electronic system, the swappable liquid connection positioned in a first location of a connection assembly to provide a liquid connection compatible with a plurality of liquid cooling systems, the swappable liquid connection to connect to a corresponding liquid connection of the electronic system, the swappable liquid connection to mate the liquid cooling system with the electronic system to directly cool the electronic system by liquid passing from the liquid cooling system through the liquid connection of the connection assembly and through the corresponding liquid connection of the electronic system to the electronic system;
• and
• a swappable air connection to connect to the electronic system, the swappable air connection positioned in a second location of the connection assembly to provide an air connection compatible with a plurality of air cooling systems, the swappable air connection to connect to a corresponding air connection of the electronic system, the swappable air connection to mate the air cooling system with the electronic system to directly cool the electronic system by air passing from the air cooling system through the air connection of the connection assembly and through the corresponding air connection of the electronic system to the electronic system,
• wherein the liquid connection and the air connection provide an interface of the connection assembly by which the liquid cooling system and the air cooling system are connected to the electronic system to permit the liquid cooling system and the air cooling system to directly and separately cool the electronic system.