Multilayered substrate and method for manufacturing the same

A multilayered substrate, comprising:

• an insulating layer;
• a conductive pattern embedded, at least partially, in the insulating layer;
• a metal pattern formed in a protruding manner on the outermost surface of the insulating layer;
• and
• a bump being electrically connected to the conductive pattern and penetrating the insulating layer,
• wherein the bump comprises:
• a low melting point metal layer having a melting point lower than a melting point of the conductive pattern;
• and
• a high melting point metal layer having a melting point higher than the melting point of the low melting point metal layer and having a latitudinal cross-sectional area smaller than a latitudinal cross-sectional area of the low melting point metal layer,
• wherein the high melting point metal layer is interposed within the insulating layer between the at least partially embedded conductive pattern and the low melting point metal layer,
• wherein an interface between the high melting point layer and the embedded conductive pattern is formed within the insulating layer, and
• wherein the metal pattern is directly coupled with the low melting point metal layer.