Connection pad for embedded components in PCB packaging

An electronic device, comprising:

• a printed circuit board (PCB), comprising:
• a first electrical circuit that comprises a plurality of metallic traces disposed in a core of the PCB and a plurality of metallic vias, wherein each via of the plurality of metallic vias is coupled to a first metallic trace of the plurality of metallic traces;
• a plurality of electrical pads, wherein each electrical pad of the plurality of electrical pads comprise a plurality of via terminations, and each respective via termination of the plurality of via terminations is associated to a respective via of the plurality of metallic vias;
• and
• an electrical component electrically coupled to the first electrical circuit and disposed in a first electrical pad of the plurality of electrical pads, wherein each respective component termination of the electrical component is in direct contact with a corresponding via termination of the plurality of via terminations.

A method comprising:

• forming a first metallic trace in a core of a printed circuit board (PCB);
• forming a first via in the PCB, wherein the first via is electrically coupled to the first metallic trace, and wherein a via termination of the first via is exposed in an electrical pad of the PCB;
• and
• disposing a first electrical component in the electrical pad of the PCB by forming a direct contact between a component termination of the first electrical component and the via termination of the first via.

A printed circuit board (PCB) assembly, comprising:

• a first plurality of metallic routes that form an electrical circuit of the PCB assembly;
• a plurality of electrical pads, wherein a first electrical pad of the plurality of electrical pads comprises:
• a first via termination of a first via, wherein the first via is electrically coupled to the first plurality of metallic routes plurality of vias electrically coupled to each other and to the first plurality of metallic routes and wherein the plurality of vias form a single connection;
• a plurality of vias electrically coupled to each other and configured to form a single connection to the first component termination of the electrical component, wherein a number of vias in the plurality of vias is based on a resistance specification or an inductance specification, and wherein the resistance specification or the inductance specification is based on the electrical component;
• and
• an electrical component electrically disposed in the first electrical pad, wherein a first component termination of the electrical component is directly contacting the first via termination and comprising a first component termination in direct contact with the single connection.