Resin substrate, component mounted resin substrate, and method of manufacturing component mounted resin substrate

A component mounted resin substrate comprising:

• a resin substrate including:
• a thermoplastic resin base body;
• a mounting land conductor provided on a surface of the resin base body and connected to the component;
• a first reinforcement conductor pattern embedded in the resin base body, and having a planar shape including a position overlapping the mounting land conductor when viewing the resin base body in plan view;
• a second reinforcement conductor pattern embedded in the resin base body, and having a planar shape of which at least a portion overlaps the first reinforcement conductor pattern, and which includes a position overlapping the mounting land conductor, when viewing the resin base body in plan view;
• and
• a plurality of first interlayer connection conductors connecting the first reinforcement conductor pattern and the second reinforcement conductor pattern in a
• thickness direction of the resin base body;
• a component joined to the resin substrate with a plurality of bumps interposed therebetween;
• a third reinforcement conductor pattern embedded in the resin base body, and having a planar shape of which at least a portion overlaps the first reinforcement conductor pattern and the second reinforcement conductor pattern, and which includes a position overlapping the mounting land conductor, when viewing the resin base body in plan view;
• and
• a plurality of second interlayer connection conductors connecting the second reinforcement conductor pattern and the third reinforcement conductor pattern in the thickness direction of the resin base body;
• wherein
• the component is mounted to the resin base body with the plurality of bumps ultrasonically joined to the mounting land conductor;
• the plurality of first interlayer connection conductors are located at positions different from the plurality of bumps when viewing the resin base body in plan view;
• the plurality of bumps entirely or substantially entirely overlap the first reinforcement conductor pattern when viewing the resin base body in plan view;
• and
• the plurality of first interlayer connection conductors and the plurality of second interlayer connection conductors are located at different positions when viewing the resin base body in plan view.